SMTPCBアセンブリ

Surface Mount SMT PCB Assembly Service

SMT chip refers to the abbreviation of a series of technological processes processed on the basis of PCB. PCB (Printed Circuit Board) is a printed circuit board. SMT is the surface mounted technology (SMT), which is the most popular technology and process in the electronic assembly industry. The surface mount technology (SMT) of electronic circuits is called surface mount technology or surface mount technology. It is a circuit assembly technology that installs surface mounted components without pins or short leads (SMC/SMD, referred to as chip element device in Chinese) on the surface of printed circuit board (PCB) or other substrates, and then assembles them by reflow soldering or dip soldering.

SEIC is an enterprise mainly engaged in electronic product processing. It mainly undertakes OEM and ODM businesses of various electronic products such as patch, plug-in, post welding, testing and assembly. The company has been engaged in electronic product processing for more than 20 years, with perfect production equipment and rich processing experience.

PCB assembly process

1.Steel mesh making and solder paste printing

There are many pads on the PCB. In the smt chip processing process, in order to make the solder paste cover a specific pad, a steel plate corresponding to the pad position needs to be made and installed on the solder paste printer to ensure that the steel plate mesh is the same as the pad position on the PCB. After the positioning is completed, the scraper on the solder paste printer moves back and forth on the steel screen, and the solder paste passes through the mesh on the steel plate and covers the PCB specific pad to complete the solder paste printing.

Preparing the PCB and Initial Circuit Board Design

2.Component mounting

The mounting machine is mainly used for mounting. The mounting machine is also called "surface mounting system". It is a device that is configured after the dispensing machine or screen printing machine to accurately place the surface mounting components on the PCB pad by moving the mounting head. It is used to realize high-speed and high-precision placement of components, and is the most critical and complex equipment in the entire SMT production.

Placing Surface Mounted Components Components

3.Reflow welding

Reflow soldering is mainly used to weld the circuit board with components already mounted. The solder paste is melted by heating to fuse the patch components with the circuit board pads, and then the solder paste is cooled by reflow soldering to solidify the components and pads together.

Reflow Soldering Process

4.AOI optical detection

Its function is to inspect the welding quality and assembly quality of the assembled PCB. The equipment used is Automatic Optical Inspection (AOI). The process of the AOI detection system is mainly to scan the PCB to be tested with optical instruments to obtain images, and then the system compares the qualified parameters in the database to check whether there are defects on the PCB through computer image processing technology. The types of defects that can be detected include short circuit, more copper and less copper, open circuit, notch, burr, copper slag, missing parts, deflection, etc.

Inspection

The advantages of SMT

♦Miniaturization
SMT chip processing has the advantages of high assembly density, small size and light weight of electronic products. The size and weight of chip components are only about 1/10 of that of traditional plug-in components. Generally, after using SMT, the volume of electronic products is reduced by 40%~60%, and the weight is reduced by 60%~80%. The distance between adjacent electrodes of SMT chip components is much smaller than the lead spacing of traditional DIP integrated circuits. At present, the minimum lead center spacing has reached 0.3mm.

♦High performance
Surface mount components reduce parasitic lead and conductor inductance, while improving the characteristics of capacitors, resistors and other components. The transmission delay is small, the signal transmission speed is fast, and the RF interference is eliminated. The circuit has better high-frequency characteristics, faster working speed, significantly reduced noise, and reduced electromagnetic interference.

♦Save materials and production costs
The volume of SMT components is generally reduced, thus reducing the consumption of packaging materials. In the SMT chip, components do not need to be reshaped or cut in advance, and PCBA circuit boards do not need to be perforated, which saves manpower and material resources, so the production cost is generally reduced.

pcb assembly team

OUR STRENGTH

Difficult PCB design experience

PCB design experience

With 1000+ PCB design experience, he is good at high-density, digital-analog hybrid, high-current, radio frequency, rigid-flex board, high-speed backplane, etc.

High-quality quality control management

High-quality control management

Equipped with a standardized design management system, level by level check and strict control, to ensure that the pass rate of each product reaches 100%.

Strong supply chain and engineering team

Strong supply chain and engineering team

The supply chain and engineering team with more than 10 years of industry experience can not only provide customers with fast quotation services, but also provide high-quality products and services.

Independently developed software

Self developed advanced production equipment

Rexxam Head Office independently developed advanced production equipment such as AOI, SPI and laser QR code, providing strong technical support for PCBA production.

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