1.Steel mesh making and solder paste printing
There are many pads on the PCB. In the smt chip processing process, in order to make the solder paste cover a specific pad, a steel plate corresponding to the pad position needs to be made and installed on the solder paste printer to ensure that the steel plate mesh is the same as the pad position on the PCB. After the positioning is completed, the scraper on the solder paste printer moves back and forth on the steel screen, and the solder paste passes through the mesh on the steel plate and covers the PCB specific pad to complete the solder paste printing.