Ball Grid Array (BGA) assembly technology is a surface mount packaging technology applied to integrated circuits, which is often used to permanently fix devices such as microprocessors. BGA assembly can accommodate more pins than other packages such as Dual in-line packages or Quad Flat Packages, and the entire bottom surface of the device can be used as pins , instead of only peripherals available, and also have a shorter average wire length than peripheral-limited package types for better high-speed performance.
SEIC has been providing BGA assembly since 1997, including BGA rework and BGA Reballing services for the printed circuit board assembly industry. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-ray inspection equipment, and highly customizable complete PCB assembly solutions, you can rely on us to build high-quality and high-yield BGA boards
PCB manufacturers faced many issues, and bridging of pins is one of them. BGA overcomes this issue, as solder balls offer the appropriate soldering required for holding the package. These solder balls are placed close to one another; this strengthens the interconnections and reduces the footprint of the PCB. High-density connections by BGA components makes effective use of the area on the PCB.
Another advantage of BGA packaging technology over other packaging technologies with discrete pins (eg, pin-containing packaging technology) is the lower thermal impedance between the package and the PCB. This allows the heat generated by the integrated circuit in the package to be more easily conducted to the PCB, preventing the chip from overheating.
Shorter conductors also mean that unnecessary inductance can be reduced, a characteristic that can cause unwanted signal distortion in high-speed electronic circuits. BGA packaging technology, the distance between the package and the PCB is very short, and with low inductance pins, it can have better electronic characteristics than pin devices.
We own a 20,000 square meters workshop, and are equipped with 7 fully automatic SMT placement lines and 2 DIP assembly lines. whether you are looking at a full production run or SMT PCB prototypes, you are assured of are quick turnaround times.
We have 7 fully automatic SMT production lines to ensure high precision and high yield of assembly, and we have the latest equipment including high-speed Yamaha placement machines, reflow ovens, X-ray and online AOI inspection systems, etc.
Due to the complicated solder quality inspection of BGA packages, and the solder balls are located under the chip, the traditional optical method cannot insist on whether the solder joints are inspected or void. For BGA components in the SMT assembly process, SEIC usually chooses electrical testing. , a combination of automated X-ray inspection and other methods to provide inspection accuracy.
We have a complete and user-friendly pre-sales and post-sales management system, which can quickly and comprehensively respond to the individual needs of customers, and provide customers with technical support, production operations and order services 24 hours a day.
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